MAX14803CCM Flash programmable ic Integrated circuit Chip 200A Current
Low-Charge Injection, 16-Channel, High-Voltage Analog Switches
FEATURES SUMMARY
♦ Integrated Overvoltage Protection (MAX14802/ MAX14803)
♦ 20MHz Serial Interface (5V)
♦ HVCMOS Technology for High Performance
♦ Individually Programmable High-Voltage Analog Switches
♦ Very Low 5µA (typ) Quiescent Current
♦ DC-to-20MHz Low-Voltage Analog Signal Frequency Range
♦ 2.7V to 5.5V Logic Supply Voltage
♦ Low-Charge Injection, Low-Capacitance RL Switches
♦ -77dB (typ) Off-Isolation at 5MHz (RL = 50Ω)
♦ Daisy-Chainable Serial Interface
♦ Flexible High-Voltage Supplies (VPP - VNN = 250V)
A part of stock list
| C.I MM74HC164MX |
FSC |
P0552AD/P9FAD |
SOP-14 |
| DIODO BYG23M-E3/TR |
VISHAY |
1632 |
SMA |
| DIODO SML4742A-E3/61 |
VISHAY |
1632/12 |
SMA |
| DIODO BYG23M-E3/TR |
VISHAY |
1632 |
SMA |
| DIODO SML4742A-E3/61 |
VISHAY |
1632/12 |
SMA |
| RES 2010 330R 5% CRCW2010330RJNEF |
VISHAY |
1612 |
SMD2010 |
| RES 2010 68K 5% CRCW201068K0JNEF |
VISHAY |
1612 |
SMD2010 |
| C.I MCP6S26-I/SL |
MICROCHIP |
16255C4 |
SOP-14 |
| ACOPLADOR. PC817A |
SHARP |
2016.08.10/H33 |
DIP-4 |
| TRANS 2SS52M |
Honeywell |
2SSM/523-LF |
TO-92 |
| C.I SCC2691AC1D24 |
|
1149+ |
SOP-24 |
| C.I TP3057WM |
TI |
XM33AF |
SOP-16 |
| C.I CD14538BE |
TI |
33ADS8K |
DIP-16 |
| C.I CL2N8-G |
MICROCHIP |
CL2C |
SOT-89 |
| C.I SN75179BP |
TI |
57C50DM |
DIP-8 |
| C.I L6219DS |
ST |
135 |
SOP-24 |
| CAP 1210 470PF 1KV NP0 CL32C471JIINNNE |
SAMSUNG |
AC7JO2H |
SMD1210 |
| INDUTOR 3.3UH SLF6045T-3R3N2R8-3PF |
TDK |
YA16H0945122/3R3 |
SMD6045 |
| CAP ELCO SMD 2.2UF 50V EEE-1HA2R2SR |
PAN |
Y1628F843536/2.2/50V/SYK |
SMD4*5.4 |
| C.I 24LC256-I/SN |
MICROCHIP |
1636M6G |
SOP-8 |
| CAP ELCO SMD 150UF 25V UCD1E151MNL1GS |
NICHICON |
160602/150/25V/H72 |
SMD8*10.5 |
| RES RC0805JR-0727RL |
YAGEO |
1538 |
SMD0805 |
| C.I SN75240PW |
TI |
11/A75240 |
MSOP-8 |
| RES RC0805JR-0715KL |
YAGEO |
1637 |
SMD0805 |
| CAP CER 0805 1UF 10V X7R LMK212BJ105MG-T |
TAIYOYUDEN |
1608 |
SMD0805 |
| CAP CER 0805 4.7UF 50V X5R CL21A475KBQNNNE |
SAMSUNG |
AC7JO2H |
SMD0805 |
| RES 0805 28K7 RC0805FR-0728K7L 1% |
YAGEO |
1638 |
SMD0805 |
| RES 3K3 5% CASE 0805RC0805JR-073K3L |
YAGEO |
1623 |
SMD0805 |
| TRIAC BTA26-600BRG |
ST |
628 |
TO-3P |
| CAP 0805 330NF 100V C2012X7S2A334K125AB |
TDK |
IB16F15763SD |
SMD0805 |
ABSOLUTE MAXIMUM RATINGS
(All voltages referenced to GND.) VDD Logic-Supply Voltage .......................................-0.3V to +7V
VPP - VNN Supply Voltage ....................................................260V
VPP Positive-Supply Voltage.................................-0.3V to +220V
VNN Negative-Supply Voltage ...............................-0.3V to -220V
Logic Inputs (LE, CLR, CLK, DIN, DOUT)................-0.3V to +7V
COM_, NO_ (MAX14800/MAX14801) ...........(-0.3V + VNN) to (VNN + 200V) COM_, NO_ (MAX14802/MAX14803).........(-0.3V + VNN) to the minimum of [(VNN + 200V) or (VPP + 0.3V)] Peak Analog Signal Current Per Channel................................3A
Continuous Power Dissipation (TA = +70°C) 48-Pin TQFP
(derate 22.7mW/°C above +70°C).........1818mW
Junction-to-Ambient Thermal Resistance (θJA) (Note 1)
48-Pin TQFP ..................................................................44°C/W
Junction-to-Case Thermal Resistance (θJC) (Note 1)
48-Pin TQFP ..................................................................10°C/W
Operating Temperature Range...............................0°C to +70°C
Storage Temperature Range .............................-65°C to +150°C
Junction Temperature..................................................... +150°C
Lead Temperature (soldering, 10s) .................................+300°C
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